Aconity 3D - ACONITYMINI and ACONITYLAB (ACONITY3D GmbH)

Powder Laser Bed Melting Suite

3D metal printing using laser beam technology

  • Partner:The University of Sheffield
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Detailed Description

The machines are unique in that they are reconfigurable, both in terms of software and hardware. This enables the user to have complete freedom and control over the various processing parameters we can use, as well as the ability to change the machine components.

The AconityMINI uses a laser beam to selectively melt an area of metal powder based on a 3D model of a component, then repeating it layer by layer until the final geometry is obtained. The machine is unique in that it is reconfigurable, both in terms of software and hardware. This enables the user to have complete freedom and control over the various processing parameters they can use, as well as the ability to change the machine components. The AconityMINI is an entry-level laboratory system with a build volume of Ø 140mmx H 200mm and is designed for efficient material research. It can be equipped with a preheating device, process monitoring or changed laser configuration.

The ACONITYLAB is a truly modifiable lab system which can either be equipped with process monitoring tools, vacuum option or high-temperature preheating of up to 1200 ̊C. Its build volume is Ø 170mm x H 200mm.

AconityMINI

  • Build space: Ø 140 mm x H 190 mm, Ø 55 mm x H 190 mm
  • Laser configuration: Single Mode 200 W / 400 W
  • Optics configuration / Spot size: F-Theta / 30 – 50 μm, 3D Scanning / 80 – 500 μm
  • Process monitoring options: Coaxial pyrometer, Coaxial high speed CMOS
  • Preheating temp / build size: 500 °C / Ø 140 mm x H 130 mm, 800 °C / Ø 100 mm x H 130 mm
  • Layer thickness: Down to 10 µm
  • Max scan speed: 4 m/s

AconityLAB

  • Build space: Ø 170 mm x H 200 mm
  • Laser configuration: Single Mode 400 W / 1000 W
  • Optics configuration / Spot size: F-Theta / 80 μm / 3D Scanning / 80 – 500 μm
  • Process monitoring options: Coaxial pyrometer / Coaxial high speed CMOS
  • Preheating temp / build space: 500 °C / Ø 170 mm x H 150 mm, 800 °C / Ø 100 mm x H 150 mm, 1200 °C / Ø 70 mm x H 150 mm
  • Layer thickness: Down to 10 µm
  • Max scan speed: 4 m/s

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