Leica VB6 electron beam lithography system

Electron Beam Lithography

Electron Beam Lithography System with a thermal field emission gun

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Detailed Description

This system has a thermal field emission gun for operation at 100 kV, a high KV for high aspect ratio nanostructures, including high speed direct write with full automatization. It can process 200 mm (8 inch) wafers and 7 inch masks with a minimum feature size less than 8 nm. The precise overlay of features size is less than 10nm.

Uses/Applications

Flexible configuration to fit application requirements, Fabrication of deep nanoscale devices, Developing novel nanoelectronic devices, On-chip integrated optoelectronic circuits, Quantum devices, Layered material related devices, Photonic systems, Plasmonic systems, Cutting edge fabrication of small scale (lab level) and expanding these capabilities towards a large scale production

The equipment can be used for flexible configuration to fit application requirements and is an essential manufacturing tool for fabrication of deep nanoscale devices. The system contributes to developing novel nanoelectronic devices, on-chip integrated optoelectronic circuits, quantum devices, layered material related devices, photonic and plasmonic systems.

It allows both the cutting edge fabrication of small scale (lab level) and expanding these capabilities towards a large scale production. It makes a bridge between the university research activities and the wafer scale manufacturing and developing new technologies and contributes to cross disciplinary research that can impact manufacturing business in the future.