The Combined Magnetron Sputtering and Electron Beam Deposition System is an ultra-high vacuum sputtering and evaporation system.
It consists of three sources for DC and RF magne-tron sputtering and four-pocket e-beam evaporator. It has two types substrate holders: one is with active cooling system; while the second is with a heating stage to 800°C and RF biasing option. Both substrate holders can handle wafers up to 4” in diameter.
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