Description
The Combined Magnetron Sputtering and Electron Beam Deposition System is an ultra-high vacuum sputtering and evaporation system.
It consists of three sources for DC and RF magnetron sputtering and four-pocket e-beam evaporator. It has two types of substrate holders: one is with an active cooling system; while the second is with a heating stage to 800°C and RF biasing option. Both substrate holders can handle wafers up to 4” in diameter.
