The Q150V Plus is optimised for high-vacuum applications, with an ultimate vacuum of 1 x 10-6 mbar. Together with the use of a wide-range Penning/Pirani gauge, this enables the sputtering of oxidising metals with ultra-fine grain sizes, which are suitable for high resolution imaging. The lower background pressure removes oxygen nitrogen and water vapour from the chamber, avoiding chemical reactions during the sputter process, which could otherwise lead to impurities or defects in the coatings. Similarly, lower scattering allows for high purity, amorphous carbon films of high density.
