Description
The SC-1 Series is a modular thin-film deposition platform designed to support advanced materials research and development. It uniquely integrates Atomic Layer Deposition (ALD) and Physical Vapor Deposition (PVD) in a single vertically stacked system, enabling both processes to be carried out sequentially without breaking vacuum or transferring the substrate. This design minimizes the risk of contamination or interfacial defects, making it especially well-suited for the fabrication of complex multilayer nanostructures where precise interface engineering is critical. This system is ideal for advanced materials research, from mechanically reinforced nanostructures to graded thin films. Its capabilities are directly applicable to critical technologies such as aerospace and automotive coatings, high-temperature films for nuclear or space environments, corrosion/oxidation resistant coatings, batteries and semiconductor devices, and hydrogen permeation barrier coatings for energy and materials science applications.
Specification
Substrates & Loading
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Wafer sizes: 2 inch
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Loading: Top-loaded with interchangeable substrate holders
Deposition Capabilities
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ALD Temperature Range: Up to 250°C
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Combined ALD & PVD in a single vacuum environment
Substrate Stages
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Temperature gradient: 30°C to 450°C
ALD System
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2 single heated/unheated lines
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2 individual gas inlets (but up to 8 sources total with modifications)
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Integrated dry vacuum pump and exhaust controls
PVD Sputtering
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2-inch targets (2off) with DC power supply
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Motorized throttle valve & turbomolecular pump
Materials Supported
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ALD & PVD layers and multi-nanolayers of (please discuss specific material requirements):
Al₂O₃, ZnO, SiO₂, TiO₂, Y₂O₃, ZrO₂, HfO₂, Cu, Al, Ti, Mg, Nb, Li, etc.
