Description
The Dimple Grinder II provides rapid material removal with minimal damage. Dimple grinding offers a fast and reliable mechanical method of pre-thinning to near electron transparency (in some cases to electron transparency) greatly reducing ion milling times and uneven thinning.
Uses / Applications
TEM specimen preparation.
Specification
Specifications Size (W x D x H) (mm) 340 x 260 x 230. Shipping weight (kg) 15
Controls Table rotation (I/0); grinding wheel rotation (I/0); transmitted/reflected light; grinding wheel speed (variable); AutoTerminator (I/0); timer (variable); micrometer zero; grinding wheel load (0 – 40 g)
