This is a key step in any lithographic process and can be used to fabricate, for instance, MEMS energy harvesters or lithographically patterned electrodes for batteries or solar cells.
This instrument enables silicon wafers to be patterned with feature sizes ranging from hundreds of micrometers down to 700 nanometers.
4th generation Karl Suss MA6 tool allows to pattern features on Si wafers down to approximately 700 nm. The alignment accuracy of the tool is 250 nm and this tool features a video assisted alignment feature. This tool can process small 10 x 10 mm samples up to 6” wafers and allows for proximity, soft, hard, and vacuum exposure. Further, the optics of this tool can be switched to either process thin or thick (e.g. SU8) photoresists and it features automatic wedge compensation. The tool is equipped with chucks to process pieces and 2, 3, 4, and 6” wafers and a range of mask holders.
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