4th generation Karl Suss MA6 tool

UV Lithography Tool

This UV lithography tool allows for patterning photoresists on silicon wafers to create a range of microelectronic devices.

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Detailed Description

This UV lithography tool allows the user to pattern photoresists on silicon wafers. This is a key step in any lithographic process, and may be used to fabricate, for instance, MEMS energy harvesters, microelectronic devices, and patterned electrodes for batteries or solar cells. The UV lithography tool is the latest fourth generation Karl Suss MA6 Mask Aligner, which allows patterning of features with resolution down to approximately 700 nm, and with an alignment accuracy of 250 nm. This tool represents a substantial evolution compared to previous generations, since all operations are fully automatic, with software-controlled optics and wafer chuck, which provides an automatic wafer edge compensation upon loading a substrate, as well as a video-assisted self-alignment function based on automatic pattern recognition of alignment marks. The tool can process substrates ranging from millimetre-sized samples up to 6-inch wafers, and allows exposure in several contact modes: proximity, soft, hard, and vacuum. Furthermore, the long-focal optics are suitable for processing either thin (high-res) or thick (e.g. SU8) photoresists.

4th generation Karl Suss MA6 tool allows to pattern features on Si wafers down to approximately 700 nm. The alignment accuracy of the tool is 250 nm and this tool features a video assisted alignment feature. This tool can process small 10 x 10 mm samples up to 6” wafers and allows for proximity, soft, hard, and vacuum exposure. Further, the optics of this tool can be switched to either process thin or thick (e.g. SU8) photoresists and it features automatic wedge compensation. The tool is equipped with chucks to process pieces and 2, 3, 4, and 6” wafers and a range of mask holders.

Uses/Applications

This instrument enables silicon wafers to be patterned with feature sizes ranging from hundreds of micrometers down to 700 nanometers.

4th generation Karl Suss MA6 tool allows to pattern features on Si wafers down to approximately 700 nm.  The alignment accuracy of the tool is 250 nm and this tool features a video assisted alignment feature. This tool can process small 10 x 10 mm samples up to 6” wafers and allows for proximity, soft, hard, and vacuum exposure. Further, the optics of this tool can be switched to either process thin or thick (e.g. SU8) photoresists and it features automatic wedge compensation. The tool is equipped with chucks to process pieces and 2, 3, 4, and 6” wafers and a range of mask holders.


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