Pulsed laser deposition chamber with load lock and RHEED

The TSST system makes use of an existing pulsed laser source and includes an optics interlocks solution and a motorised attenuator for better tuning of the laser power.  A custom-made glovebox allows for clean loading and unloading of substrates and target materials. The system itself has a laser beam scanning option, which in combination with a rotating substrate and a scanning target option allows for upscaling of the substrates to 2-inch wafers. A sputter source with both RF and DC power supplies has been added to the system to allow metal (lithium) deposition, which enables devices to be fully finished in-situ.