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Ultra-high vacuum sputtering and evaporation system
- Partner:Imperial College London
- Facility:Thin Film Technology Laboratory
- Availability:Available
Or call us now on 0161 275 8382
Detailed Description
The Combined Magnetron Sputtering and Electron Beam Deposition System is an ultra-high vacuum sputtering and evaporation system.
The e_line uses a focused electron beam to expose a thin layer of electron beam resist changes the solubility of the resist in it’s developer. For positive resist dubmergin in developer will remove the exposed resit. For negative resist the unexposed resist will be removed. These structures can be samples themselves or can be used as stencles for the deposition of thin film materials.
It consists of three sources for DC and RF magnetron sputtering and four-pocket e-beam evaporator. It has two types substrate holders: one is with active cooling system; while the second is with a heating stage to 800°C and RF biasing option. Both substrate holders can handle wafers up to 4” in diameter.
Uses/Applications
https://www.raith.com/company/micrograph-award/winner-applications/
-5-30 kV beam energies,100um write field size, >2nm stiching error, 7.5-120um beam appatures, common to achive 20nm feature size with 10nm gaps, 3D SEM stage for angled sample inspection, >5nm SEM resolution.